ACF bonding, also known as Anisotropic Conductive Film bonding, is a method used in various industries, particularly in the manufacturing of liquid crystal displays (LCDs) and other electronic devices. It involves the use of an adhesive interconnect system to create electrical and mechanical connections between different components.
Here is some information about ACF bonding:
What is ACF bonding?
ACF bonding refers to the process of using anisotropic conductive film, which is a type of adhesive, to establish electrical connections between components in electronic devices .
The film is made of resins, such as thermoset epoxy resin, in which conductive particles are dispersed. It can achieve conductivity vertically, or in the direction of compression, and insulation quality horizontally, or in the perpendicular direction to compression .
ACF bonding is commonly used in LCD manufacturing to connect the electrodes of glass substrates to the electrodes of IC chips or flexible substrate circuits .
Usages of ACF bonding:
1.LCDs and OLED displays: ACF bonding is extensively used in flat panel displays, including smartphones, tablets, PCs, and televisions. It is used to electrically connect the electrodes of the glass substrates to the electrodes of IC chips or flexible substrate circuits, and also physically fix them .
2.Touch sensors: ACF bonding is also used in touch sensors, which are built on or in the display of smartphones and tablets. It helps connect the transparent electrodes on a transparent film substrate or glass substrate to the electrodes and driver ICs for sensing .
3.Semiconductor device connection: ACF bonding is adopted in various semiconductor devices, such as CMOSs or CCDs in camera modules, micro-LEDs, and secondary mounting processes .
How to use ACF bonding:
ACF is attached to the cleaned surface of a substrate, such as a glass substrate or flexible printed circuit (FPC) .
Heat and pressure are then applied to the ACF without removing the film liner .
This process compresses the conductive particles in the ACF, creating a conductive path between the electrodes and forming a secure bond .
